Goals and Tasks for the Development of Chongqing Instrumentation

Development objectives of Chongqing Instrumentation:

Chongqing Instrument places great emphasis on industrial transformation and upgrading, develops strategic emerging industries, safeguards and improves people’s livelihoods, and adopts a systematic approach to advancing the entire industrial chain. ; Addressing key challenges such as intelligence, networking, and the reliability and safety of core industrial products; completing the independent design, R&D, and industrialization of multiple high-precision instruments and novel sensors; prioritizing the strategic needs of emerging industries—including the Internet of Things, environmental protection, and food safety—as well as cultural heritage preservation and transmission; establishing a platform for industry‑wide general‑purpose technologies to support independent innovation and sustained, high‑quality development. As a result, the overall level of industry development has improved markedly.

   Key tasks of Chongqing Instrument:

   (1) Key Basic Materials

The application fields facing high-end instrumentation, aerospace, marine, medical, automotive, consumer electronics, and other high-performance specialty functional materials industries. Chongqing Instrumentation will conduct fundamental theoretical research on novel sensing materials such as piezoelectric thin films, as well as ceramic materials, thermoelectric sensing materials, temperature‑sensitive materials, gas‑sensing materials, metal‑oxide materials, polymer materials, and optoelectronic materials. It will also undertake key technological studies covering microstructural characterization, principle analysis, material modification, performance evaluation, and the analysis of service performance and influencing factors. Furthermore, it will address critical technologies underlying the fabrication of materials like silicon, scintillation crystals, silicon carbide single crystals, piezoelectric single crystals, high‑temperature insulating materials, sputtering target materials, alloy materials, precision resistors made from precious metals, and strain gauges. Research will be carried out on manufacturing processes to achieve high alloy purity, optimize metallurgical and heat‑treatment procedures, and enhance electrical and mechanical properties, while exploring plastic deformation during alloy rolling and high‑precision cold‑rolling techniques. In addition, the company will pursue R&D on cutting‑edge new materials, including magnetorheological elastomers, nanomaterials, superconducting materials, smart materials, catalytic materials, anisotropic multilayer composites, and heterogeneous structural materials.

   (II) Core Components

Chongqing Instrumentation develops high-performance core and critical source components in optics, acoustics, electronics, frequency control, and timekeeping. It has achieved breakthroughs in the design of high-power semiconductor laser chips, the research on narrow-bandwidth external-cavity locking technology, and the development of high-performance semiconductor laser sources, overcoming challenges in acoustics… - Key technologies such as novel electro‑acoustic transducer designs and acoustic beam steering and focusing control have been developed, leading to the creation of a series of high‑precision, high‑power, integrated ultrasonic power supplies. Priority R&D efforts are focused on multi‑source heterogeneous energy harvesting, adaptive impedance matching, and highly efficient, stable, and reliable dedicated power supplies. Additionally, research is underway on key technologies including ultra‑wideband high‑frequency synthesis and ultra‑wideband agile frequency generation. R&D is also being conducted on frequency sources operating in the 5G, millimeter‑wave, and terahertz bands. Furthermore, breakthroughs have been achieved in critical areas such as three‑dimensional integration of atomic clocks and servo control, enabling the development of chip‑scale atomic clocks.

Chongqing Instrument is set to develop high-performance, miniaturized hydrophones, Acoustic sensors such as MEMS microphones, MEMS ultrasonic flow sensors, and ultrasonic wind‑speed/wind‑direction sensors; optoelectronic sensors and detectors including CCD image sensors, CMOS image sensors, balanced photodetectors, InGaAs avalanche photodetectors, uncooled infrared detectors, graphene‑based MEMS image sensors, and deep‑ultraviolet solar‑blind image sensors. Miniaturized, high‑precision inertial sensors such as gyroscopes, accelerometers, and attitude sensors; high‑accuracy MEMS resonant, piezoresistive, and high‑temperature pressure sensors; and high‑precision biochemical sensors, including gas sensors, ion sensors, and human‑physiological‑sign sensors.